Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent
1998-06-12
1999-11-23
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
257753, 257763, 257770, 257775, 257776, H01L 2348, H01L 2352
Patent
active
059905611
ABSTRACT:
A method for producing a glue layer for an integrated circuit which uses tungsten plugs in accordance with the present invention includes: (A) providing a substrate which has a surface, a center, an edge, and a direction normal to the surface; and (B) sputter depositing a glue layer over the surface of the substrate such that an edge thickness of the glue layer measured in the direction normal to the surface at the edge of the substrate is at least 105% of a center thickness of the glue layer measured in the direction normal to the surface at the center of the substrate. In some embodiments, the edge thickness of said glue layer measured in the direction normal to the surface at the edge of the substrate is in the range of approximately 105% to 150% of the center thickness of the glue layer measured in the direction normal to the surface at the center of the substrate, as for example in the range of approximately 110% to 120% of the center thickness of the glue layer measured in the direction normal to the surface at the center of the substrate.
REFERENCES:
patent: 5278449 (1994-01-01), Miyakawa
patent: 5407861 (1995-04-01), Marangon et al.
patent: 5600182 (1997-02-01), Schinella et al.
Roede, Henk et al., "The Effect of Post W-Etchback Cleaning Treatments and Implementation of Refractory Metal Buffer Layers on the Electromigration Performance of TiN/AlCu/TiN/Ti Metallization Systems," Apr. 1995, pp. 1-6.
Gabriel Calvin T.
Lin Xi-Wei
Pramanik Dipankar
Thomas Tom
VLSI Technologies, Inc.
Vu Hung Kim
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