High resistivity integrated circuit resistor

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

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257537, 257516, 257379, H01L 298605

Patent

active

059905387

ABSTRACT:
The present invention teaches fabrication of a high-resistance integrated circuit diffusion resistor that uses standard CMOS process steps. By appropriate masking during ion-implantation of source/drain diffusion regions, diffusion resistors created during NMOS source/drain implant may be counterdoped during PMOS source/drain implants and vice-versa. By appropriate choice of relative concentrations of a resistor dopant and counterdopant, and choice of diffusion depths, junction diodes can be formed which create a pinched resistor by constricting the current flow. The relative dopant concentrations can also be chosen to create regions of light effective doping within the diffusion resistor rather than creating junction diodes.

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Chen, T.C., et al., "Submicrometer Si and Si-Ge Epitaxial-Based Double-Poly Self-Aligned Bipolar Transisitors", IEEE Transactions on Electron Devices, vol. 38, No. 4, pp. 941-943; 124-127, (Apr. 1991).

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