Broken blade detector for semiconductor die saws

Details Broken blade detector for semiconductor die saws Broken blade detector for semiconductor die saws

1990-06-22

1991-07-16

Rosenbaum, Mark

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

5116572, 83 621, 8352227, B24B 4912

Patent

active

050313606

ABSTRACT:
A dicing saw for semiconductors includes a defect detector which is used for stopping operation of the dicing saw when such operation would be adverse to the integrity of the work product (semiconductor dice). Infrared light from a light transducer is transmitted from a light transmitter to a detector at an opposite side of the saw's blade from the transmitter. Infrared light from a light transducer is also reflected from the dicing saw blade edge back to the transducer, permitting detection of reflected light along with the detection of light across the blade.

REFERENCES:
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patent: 3835591 (1974-09-01), Cimprich
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patent: 4664571 (1987-05-01), Takada et al.
patent: 4674374 (1987-06-01), Sadahiro et al.
patent: 4771665 (1988-09-01), Van Doorn et al.

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