Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-06-01
1997-11-11
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29827, 29884, H01R 4316
Patent
active
056850735
ABSTRACT:
A printed circuit board modular assembly is disclosed. The disclosed invention comprises a first printed circuit board having an electronic terminal portion for providing electrical connection to the first printed circuit board; a second printed circuit board having an electrical terminal portion for providing electrical connection to the second printed circuit board; a spacing member disposed between the first and second printed circuit boards; and electrical signal transmission contacts situated on the spacing member for providing electrical connection between the first printed circuit board and the second printed circuit board.
REFERENCES:
patent: 3147402 (1964-09-01), Hochstetler
patent: 3173732 (1965-03-01), James
patent: 3382414 (1968-05-01), Borner
patent: 3447040 (1969-05-01), Denton, Jr.
patent: 3546775 (1970-12-01), Lalmond et al.
patent: 3551750 (1970-12-01), Sterling
patent: 3593064 (1971-07-01), Wagner et al.
patent: 3727168 (1973-04-01), Henschen et al.
patent: 3735206 (1973-05-01), Pesek
patent: 3924915 (1975-12-01), Conrad
patent: 3960424 (1976-06-01), Weisenburger
patent: 3998512 (1976-12-01), Anhalt et al.
patent: 4028794 (1977-06-01), Ritchie et al.
patent: 4057311 (1977-11-01), Evans
patent: 4203203 (1980-05-01), Gilissen et al.
patent: 4245876 (1981-01-01), Ritchie et al.
patent: 4295700 (1981-10-01), Sado
patent: 4402562 (1983-09-01), Sado
patent: 4511196 (1985-04-01), Schuler et al.
patent: 4616416 (1986-10-01), Cabaud
patent: 4689721 (1987-08-01), Damerow et al.
patent: 4757780 (1988-07-01), Spigarelli et al.
patent: 4769908 (1988-09-01), Olsson
patent: 4927369 (1990-05-01), Grabbe et al.
patent: 4983126 (1991-01-01), Busse et al.
patent: 4998886 (1991-03-01), Werner
patent: 5088929 (1992-02-01), Enomoto
Estes H. Scott
Ganthier James J.
Arbes Carl J.
Compaq Computer Corporation
LandOfFree
Method of manufacturing board-to-board connector does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing board-to-board connector, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing board-to-board connector will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1219972