Process for fabricating Bi-CMOS integrated circuit

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257552, H01L 2170, H01L 2700

Patent

active

051790360

ABSTRACT:
A process for fabricating a Bi-CMOS integrated circuit according to the present invention comprises the steps of growing a P-type epitaxial layer after formation of buried layers, forming N-type diffusion layers in the epitaxial layer for forming the P-channel MOS transistor, an NPN transistor and a PNP transistor.

REFERENCES:
patent: 4637125 (1987-01-01), Iwasaki et al.
patent: 4694562 (1987-09-01), Iwasaki et al.
patent: 4956305 (1990-09-01), Arndt
patent: 4965220 (1990-10-01), Iwasaki

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for fabricating Bi-CMOS integrated circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for fabricating Bi-CMOS integrated circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for fabricating Bi-CMOS integrated circuit will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1219822

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.