Composite material and method of manufacturing the same

Details Composite material and method of manufacturing the same Composite material and method of manufacturing the same

1996-11-07

1999-11-23

Thibodeau, Paul

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428547, 428551, 428610, 428634, 428668, 419 10, 419 13, 419 14, 419 15, 419 18, B32B 1504, B22F 300, C22C 3200

Patent

active

059897317

ABSTRACT:
In a composite material manufactured by connecting a sintered body to a surface of a metal substrate, the connection strength under a high temperature is increased, stress relaxation in the composite material is attained, and the strength, wear resistance and corrosion resistance are improved. The sintered body has a multilayer structure having layers with different compositions, i.e. compositions that vary or differ in a direction perpendicular to the connection surface, and the volume relation between the respective layers of the sintered body and the substrate is (substrate volume.times.0.2).gtoreq.(sintered body volume
umber of layers), while the thickness of each layer is at least 0.2 mm and not more than 5 mm.

REFERENCES:
patent: 4066451 (1978-01-01), Rudy
patent: 4650722 (1987-03-01), Brown et al.
patent: 4830930 (1989-05-01), Taniguchi et al.
patent: 4911989 (1990-03-01), Minoru et al.
patent: 5279901 (1994-01-01), Akerman et al.
patent: 5580666 (1996-12-01), Dubensky et al.
patent: 5623723 (1997-04-01), Greenfield

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