Resin composition and a process for preparing laminates therefro

Details Resin composition and a process for preparing laminates therefro Resin composition and a process for preparing laminates therefro

1986-07-30

1987-12-15

Pertilla, Theodore E.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156282, 1563082, 156311, 427 58, 427 96, 525511, B05D 512

Patent

active

047131373

ABSTRACT:
An epoxy resin composition having exceptional stability which is useful in the preparation of electrical laminates comprises an epoxy resin such as the diglycidyl ether of bisphenol A, an organic solvent, a polyhydric phenolic hardener and an acid having a pKa at 25.degree. C. of less than 2.5 or an ester of anhydride of such acid. The epoxy resin composition can also contain a bisphenol or bisphenol derivative such as bisphenol A. In addition, an accelerator such as an alkyl substituted imidazole can also be added to the composition prior to its use as in the preparation of electrical laminates.

REFERENCES:
patent: 4668718 (1987-05-01), Schreiber

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