Method for making polishing pad with elongated microcolumns

Details Method for making polishing pad with elongated microcolumns Method for making polishing pad with elongated microcolumns

1997-08-01

1999-11-23

Silbaugh, Jan H.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

264277, 2642791, 264317, 264344, B32B 3106, B29C 3108, B29B 1700

Patent

active

059894709

ABSTRACT:
A polishing pad for use in chemical-mechanical planarization (CMP) of semiconductor wafers includes a multiplicity of elongated microcolumns embedded in a matrix material body. The elongated microcolumns are oriented parallel to each other and extend from a planarizing surface used to planarize the semiconductor wafers. The elongated microcolumns are uniformly distributed throughout the polishing pad in order to impart uniform properties throughout the polishing pad. The polishing pad can also include elongated pores either coaxial width or interspersed between the elongated microcolumns to provide uniform porosity throughout the polishing pad.

REFERENCES:
patent: 5020283 (1991-06-01), Tuttle
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5297364 (1994-03-01), Tuttle
patent: 5421769 (1995-06-01), Schultz et al.
patent: 5533923 (1996-07-01), Shamouillan et al.
patent: 5584146 (1996-12-01), Shamouillan et al.

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