Semiconductor device and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

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257666, 257664, 257723, H01L 2334

Patent

active

058893253

ABSTRACT:
A semiconductor device includes an insulation film formed on a metal substrate, wiring patterns formed on the insulation film, and electrodes of a semiconductor chip connected to one ends of the wiring patterns, wherein a plurality of resistors are formed on at least one of surfaces of a front and a back of the insulation film and one ends of the resistors are connected to the electrodes of semiconductor chip through the wiring patterns.

REFERENCES:
patent: 4879588 (1989-11-01), Ohtsuka et al.
patent: 5399905 (1995-03-01), Honda et al.

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