IC positioning device in IC socket

Electrical connectors – Coupling part having handle or means to move contact...

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Details

439 72, H01R 1122

Patent

active

059890487

ABSTRACT:
A device is provided for positioning an IC having a plurality of leads arranged in array along side surfaces of an IC body. The IC positioning device in an IC socket comprises a locator for pressing an outer side surface of a lead located on an extreme arraying end of the lead array group. The locator is moved while pressing side surfaces of leads which are displaced in an array direction, so that the lead array group and the IC body are moved to predetermined positions.

REFERENCES:
patent: 5205756 (1993-04-01), Myers
patent: 5387118 (1995-02-01), Kishi etal.
patent: 5447444 (1995-09-01), Matsuoka
patent: 5490795 (1996-02-01), Hetzel et al.
patent: 5626481 (1997-05-01), Abe

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