Circuit board having a wiring structure buried in a resin layer

Details Circuit board having a wiring structure buried in a resin layer Circuit board having a wiring structure buried in a resin layer

1996-01-03

1998-07-07

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174251, 174255, 361760, 361761, 361774, 361777, 361779, 361813, H05K 111, H05K 116

Patent

active

057778515

ABSTRACT:
A circuit board including a resin layer and a wiring structure buried in the resin layer for forming an electric circuit. In the circuit board, the wiring structure is provided with a connecting part for soldering a first electrical part. The wiring structure is provided with a connecting hole for connecting a second electrical part by inserting a fastening member, and the connecting part is positioned on a surface of the resin layer.

REFERENCES:
patent: 1803017 (1931-04-01), Herschmann
patent: 3038105 (1962-06-01), Brownfield
patent: 3216089 (1965-11-01), Dettman
patent: 3388464 (1968-06-01), Pretty
patent: 3898535 (1975-08-01), Ebbert
patent: 3978375 (1976-08-01), Fukui et al.
patent: 4600971 (1986-07-01), Rose et al.
patent: 5599201 (1997-02-01), Sommer et al.

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