Polishing pad

Abrasive tool making process – material – or composition – Impregnating or coating an abrasive tool

Patent

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Details

51395, 511313, 51DIG34, 51209R, 51209DL, B24B 722

Patent

active

051779080

ABSTRACT:
A polishing pad for semiconductor wafers, having a face shaped to provide a constant, or nearly constant, surface contact rate to a workpiece such as a semiconductor wafer, in order to effect improved planarity of the workpiece. The favored face shape is a sunburst pattern having nontapered rays, coaxial with the pad's rotation.

REFERENCES:
patent: 2409953 (1946-10-01), Pash
patent: 3495362 (1970-02-01), Hillenbrand
patent: 3517466 (1970-06-01), Bouvier
patent: 4663890 (1987-05-01), Brandt

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