Submicron isolated, released resistor structure

Electrical resistors – With base extending along resistance element – Resistance element and/or terminals printed or marked on base

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338 64, 338314, H01C 1012

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active

052870820

ABSTRACT:
A submicron resistor having negligible parasitic capacitance includes an isolated released beam carried on a single crystal silicon wafer. The resistor is fabricated by defining a resistor region in the substrate, doping the region to produce the desired resistivity, and etching around the region to produce a resistive island. The island is then isolated from the substrate by oxidation, and is released by removing the oxide to produce an isolated, released resistor beam.

REFERENCES:
patent: 4437226 (1984-03-01), Soclof
patent: 4648173 (1987-03-01), Malaviya
patent: 4668865 (1987-05-01), Gimzewski et al.
patent: 4670092 (1987-06-01), Motamedi
patent: 4685198 (1987-08-01), Kawakita et al.
patent: 4764799 (1988-08-01), Malaviya
patent: 4776924 (1988-10-01), Delapierre
patent: 4845048 (1989-07-01), Tamaki et al.
patent: 5043577 (1991-08-01), Pohl et al.
"Formation of submicron silicon-on-insulator structures by lateral oxidation of substrate-silicon islands" Arney and MacDonald, J. Vac. Sci. Technol. B 6(1) Jan./Feb. 1988 pp. 341-345.
"TEM Characterization of defect configurations in Submicron SOI Structures" N. D. Theodore et al; Preprint: Proc. 6th Int. Conf. on Microscopy of Semiconducting Materials, Oxford, UK, Apr. 10-13, 1989.

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