Polyimide precursor and method and composition for preparing it

Details Polyimide precursor and method and composition for preparing it Polyimide precursor and method and composition for preparing it

1975-04-30

1977-02-08

Lee, Lester L.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260 326N, 260 63N, 260 65, 260 775R, 260 78TF, 428458, 428474, C08G 7310

Patent

active

RE0291340

ABSTRACT:
A composition is disclosed of a dianhydride and a tetracarboxylic acid in the proportions of about 50 to about 70 mole % dianhydride to about 30 to about 50 mole % tetracarboxylic acid, a stoichiometric amount of an aromatic diisocyanate, and a solvent for the dianhydride, the tetracarboxylic acid, and the diisocyanate. A polyimide precursor is prepared by heating the composition at about 30.degree. to 70.degree. C until the evolution of carbon dioxide substantially ceases, and then at about 30.degree. to about 100.degree. C until its viscosity is about Q to about Z6 on the Gardner-Holdt viscosity scale at 18% solids. The polyimide precursor can be spread on a substrate and cured to produce a polyimide film or coated on a wire and cured to produce a polyimide wire enamel.

REFERENCES:
patent: 3179614 (1965-04-01), Edwards
patent: 3300420 (1967-01-01), Frey
patent: 3489696 (1970-01-01), Miller
patent: 3666709 (1972-05-01), Suzuki et al.
patent: 3708458 (1973-01-01), Alberino et al.

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