Method for forming position alignment marks in a manufacturing S

Details Method for forming position alignment marks in a manufacturing S Method for forming position alignment marks in a manufacturing S

1992-05-08

1994-02-15

Maples, John S.

Fishing, trapping, and vermin destroying

437191, 437228, 437974, H01L 23544, H01L 21441

Patent

active

052866734

ABSTRACT:
A position alignment mark is formed by simultaneously forming on a silicon substrate an alignment marking contact hole and a back surface electrode contact hole, respectively, in a field zone and an element zone. A wiring pattern layer and a back surface electrode are formed on the field zone and element zone, respectively. A silicon layer is cut from the back surface of the silicon substrate to expose the wiring pattern layer and an alignment marking contact hole pattern. The contact hole pattern is then used as an alignment mark for forming a surface electrode.

REFERENCES:
patent: 4309813 (1982-01-01), Hull
patent: 4468857 (1984-09-01), Christian et al.
patent: 4737033 (1988-04-01), Moldovan et al.
patent: 5183783 (1993-02-01), Ohta et al.

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