Solid-state imaging device and method of manufacturing the same

Details Solid-state imaging device and method of manufacturing the same Solid-state imaging device and method of manufacturing the same

1992-05-26

1994-02-15

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 50, 437200, H01L 21339

Patent

active

052866696

ABSTRACT:
The invention relates to a solid-state imaging device in which a light-sensitive element region and a charge transfer region are separately formed on a semiconductor substrate of a first conductivity type by implanting an impurity of a second conductivity type into the substrate. A channel region is formed between these two regions by implanting an impurity of the first conductivity type into the substrate. Next, charge transfer electrodes made of a light-proof material are formed on the light-sensitive element region and the charge transfer region, with insulating films thereunder.
An alloy of a high-melting-point metal and silicon is used in the construction of the charge transfer electrodes, and this alloy is subjected to high-temperature processing in an atmosphere of O.sub.2.

REFERENCES:
patent: 4290187 (1981-09-01), Stein
patent: 4337476 (1982-06-01), Fraser et al.
patent: 4608749 (1986-09-01), Harada et al.
patent: 4679301 (1987-07-01), Blanchard et al.
patent: 4691218 (1987-09-01), Boudewijns
patent: 4725872 (1988-02-01), Blouke et al.
patent: 4774586 (1988-09-01), Koike et al.
patent: 4908684 (1990-03-01), Koike et al.
patent: 4992392 (1991-02-01), Nichols et al.
patent: 5028972 (1991-07-01), Watanabe et al.
Wolf et al., "Silicon processing for the VLSI Era", pp. 384-396, 1986.
Mochizuki Toru, Patent Abstracts of Japan, vol. 5, No. 103 (E-064), Jul. 3, 1981, "Manufacture of Semiconductor Device".
Ishikawa Onori, Patent Abstracts of Japan, vol. 11, No. 31 (E-475), Jan. 29, 1987, "Solid State Image Pick-Up Device and Manufacture".
Yasumi Miyagawa, Patent Abstracts of Japan, vol. 12, No. 369 (E-665), Oct. 4, 1988, "Solid-State Image Sensing Device".
Eiji Aramaki, Patent Abstracts of Japan, vol. 13, No. 114 (E-730), Mar. 20, 1989, "Solid-State Image Pick-Up Element".

Affiliated with

Also associated with

Rating

Solid-state imaging device and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solid-state imaging device and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solid-state imaging device and method of manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1206651