Wafer processing apparatus

Details Wafer processing apparatus Wafer processing apparatus

1997-07-07

1999-03-30

Coe, Philip R.

Cleaning and liquid contact with solids

Apparatus

With movably or flexibly mounted spray or jet applying...

134184, 134199, 134902, B08B 312

Patent

active

058876073

ABSTRACT:
A wafer processing apparatus is provided and includes a wafer carrier positioned in a processing vessel and arranged to support a plurality of wafers within the processing vessel such that the wafers define respective wafer gaps between adjacent wafers. A drive assembly is arranged to position respective processing plates in the respective wafer gaps such that respective major plate surfaces oppose respective major wafer surfaces. The processing plates are arranged to initiate a wafer processing operation.

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patent: 5427622 (1995-06-01), Stanasolovich et al.
patent: 5520205 (1996-05-01), Guldi et al.
patent: 5533540 (1996-07-01), Stanasolovich et al.
patent: 5534076 (1996-07-01), Bran
patent: 5579792 (1996-12-01), Stanasolovich et al.
patent: 5672212 (1997-09-01), Manos
patent: 5698038 (1997-12-01), Guldi et al.
patent: 5698040 (1997-12-01), Guldi et al.
"Megasonics" http://clean.rti.org/me-gen.htm, Mar. 20, 1997.
"Silicon Processing For the VLSI Era" by Stanley Wolf Ph.D., (Lattice Press) pp. 514-520.
"Microchip Fabrication" by Peter Van Zant, (McGraw-Hill) pp. 172-182.

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