Method of mounting a plurality of ball leads onto a BGA socket

Details Method of mounting a plurality of ball leads onto a BGA socket Method of mounting a plurality of ball leads onto a BGA socket

1997-11-06

1999-03-30

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174266, 22818022, 228254, 439 70, H01R 900

Patent

active

058873449

ABSTRACT:
A universal production ball grid array socket is provided for use with a ball grid array package. The socket will receive a ball grid array package and in turn can be mounted or plugged into an underlying circuit board. One embodiment of the socket includes a tulip-shaped contact which is capable of receiving ball grid array ball leads of various diameters. Another embodiment of the socket includes a ball receiving contact capable of clasping an inserted ball grid array ball lead. In still another embodiment the universal production ball grid array socket is translucent allowing for visual inspection of a ball grid array package and ball grid array socket combination. Methods are provided for mounting a plurality of ball leads onto the bases of a plurality of ball receiving contacts after the contacts have been mounted within the universal production ball grid array socket.

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