Process and apparatus for the hermetic adhesive bonding of plast

Details Process and apparatus for the hermetic adhesive bonding of plast Process and apparatus for the hermetic adhesive bonding of plast

1992-01-13

1994-02-15

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

296234, 156 69, 118410, C09J 500

Patent

active

052863395

ABSTRACT:
A process and apparatus for the hermetic adhesive bonding of plastic casing parts of a battery or of a galvanic cell. The casing comprises a plastic casing container and a top or bottom of the same type of plastic, preferably of polyamide, which are adhesively bonded to each other by means of a pair of joining surfaces. For adhesive bonding, the joining surface of one of the two parts is wetted at specific locations with a solvent dissolving the plastic, preferably with formic acid, over a time period of 5 to 7 seconds. The joining surface is aired at room temperature in still air over a time period of about 15 to 25 seconds, and the casing parts are then joined to each other and pressed together with pressure maintained over a time period of about to 5 to 10 minutes.

REFERENCES:
patent: 1008628 (1963-10-01), Staude
patent: 1784216 (1930-12-01), Aldrich et al.
patent: 2993826 (1961-07-01), Mendelsohn
patent: 3053609 (1959-02-01), Miller
patent: 3073736 (1955-10-01), Lange
patent: 3224411 (1965-12-01), Blaha et al.
patent: 3300370 (1965-07-01), Epstein
patent: 3499814 (1967-06-01), Bisell
patent: 3549789 (1970-12-01), Haroldson
patent: 3873400 (1975-03-01), Tsuchida et al.
patent: 3938467 (1976-02-01), Radowicz
patent: 4102304 (1978-07-01), Debenham
patent: 4698116 (1987-10-01), Bassett et al.
patent: 4842469 (1989-06-01), Schmidt
patent: 4863792 (1989-09-01), Mrozinski
patent: 5039370 (1991-08-01), Cesaroni
"Taschenbuch der Kitte und Klebstoffe" pp. 190-191 328-329.

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