Method of forming EMI shielded enclosures, EMI shielded enclosur

Details Method of forming EMI shielded enclosures, EMI shielded enclosur Method of forming EMI shielded enclosures, EMI shielded enclosur

1991-12-09

1994-02-15

Aftergut, Jeff H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

52 791, 174 35MS, E04F 1500, H05K 900

Patent

active

052863182

ABSTRACT:
A method of forming EMI shielded enclosures, an EMI shielded enclosure and EMI shield are provided. A sealer composition is applied onto a surface and is allowed to substantially dry cure into a uniform, seamless layer. An adhesive composition is applied to the dried sealer composition. Then, an electrically-conductive material, such as metallic sheet, such as copper sheeting, is attached to the dried sealer composition by the adhesive composition. Alternatively, a bonded sheet of dielectric material is applied to the adhesive composition. Then the metallic sheet is attached to the bonded sheet of dielectric material by an adhesive composition second layer.

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