Integrated circuit semiconductor device having improved wiring s

Details Integrated circuit semiconductor device having improved wiring s Integrated circuit semiconductor device having improved wiring s

1987-06-18

1989-04-25

James, Andrew J.

357 40, 357 47, 357 49, 357 54, 357 71, H01L 2710, H01L 2702, H01L 2934

Patent

active

048252760

ABSTRACT:
An integrated circuit semiconductor device having an improved power supply wiring structure is disclosed. The wiring includes a wide conductive layer and a plurality of stripe type narrow conductive layers formed on the wide conductive layer via an insulating film. Each of stripe type conductive layers is connected to the wide conductive layer through a plurality of contact holes provided in the insulating film.

REFERENCES:
patent: 4500906 (1985-02-01), Ohno et al.
patent: 4523106 (1985-06-01), Tanizawa et al.
patent: 4654689 (1987-03-01), Fujii
patent: 4661815 (1987-04-01), Takayama et al.

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