Methods for identifying semiconductor wafer with bar code patter

Details Methods for identifying semiconductor wafer with bar code patter Methods for identifying semiconductor wafer with bar code patter

1987-05-19

1989-04-25

Nelms, David C.

Radiant energy

Photocells; circuits and apparatus

Optical or pre-photocell system

250568, 235462, G06K 710

Patent

active

048250937

ABSTRACT:
In an automatic wafer process for gate array integrated circuits, it becomes necessary to identify the wafer every time at the beginning of each process. However, it is difficult for conventional methods to identify the wafer by detecting a bar code pattern because of a low contrast due to reflection of the deposited layers. The present invention provides a method in which the light source, which abundantly includes infrared rays, located on the back side of the wafer and a detector located on the front side thereof. The infrared rays are irradiated onto the wafer easily penetrate the silicon wafer. The infrared rays are received without an effect of reflection due to the deposited layers on the front side of the wafer. The first metallization layer is a very suitable layer to form the bar code pattern, which is easily marked by a laser beam scriber.

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Solid State Technology, vol. 22, No. 6, Jun. 1979, "Coding and Decoding of Wafers", B.I.C.F. Van Pul, pp. 77-79.
IBM Technical Disclosure Bulletin, vol. 25, No. 1, Jun. 1982, "Laser-Written and Read Symbol Set of High Radix", by Nielsen et al., pp. 319-322.

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