Solder reflow mounting board

Details Solder reflow mounting board Solder reflow mounting board

1993-04-29

1994-12-13

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361767, 361771, H05K 102

Patent

active

053731131

ABSTRACT:
A process for reflow mounting an electronic component includes coating a terminal electrode on a mounting board with a second solder having a second melting point higher than a reflow temperature, placing the mounting board with the electronic component on a mounting land on a conveyor which may be brought into contact with the second solder on the terminal electrode, and heating the mounting board to the reflow temperature. The terminal electrode may be coated with a solder repelling material at a selected dividing area effective for dividing the terminal electrode into a plurality of sections substantially isolated from each other in terms of solder flow. Alternatively, a mounting jig may be used for supporting the mounting board without bringing the second solder on the terminal electrode into contact with the mounting jig.

REFERENCES:
patent: 4339785 (1982-07-01), Oshawa
patent: 4767892 (1988-08-01), Robari
patent: 4901135 (1990-02-01), Neugebauer et al.
patent: 5066544 (1991-11-01), Betrabet et al.
patent: 5184767 (1991-12-01), Estes
patent: 5250757 (1993-10-01), Kawakami

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