Semiconductor device

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357 43, 357 91, H01L 29167

Patent

active

049566938

ABSTRACT:
Disclosed is a semiconductor device having a support region, an element-forming region (e.g., an epitaxial layer) and a buried layer between the support region and the element-forming region, with at least one of a MOS element and a bipolar element being formed in the element-forming region. The feature of the present invention resides in that atoms of at least one element selected from oxygen, nitrogen, carbon, argon, neon, krypton and helium is contained in a layer in at least one of the element-forming region and the buried layer, so as to suppress auto-doping of impurities from the buried layer into the element-forming region and suppress swelling of the buried layer.

REFERENCES:
patent: 3622382 (1971-11-01), Brack et al.
patent: 4053925 (1977-10-01), Burr
patent: 4082571 (1978-04-01), Graul et al.
patent: 4490182 (1984-12-01), Scovell
patent: 4559696 (1985-12-01), Anand et al.
patent: 4689667 (1987-08-01), Aronowitz
patent: 4694321 (1987-09-01), Washio et al.
IBM Technical Disclosure Bulletin, vol 27, #8, by Martin, Jan. 1985, pp. 4693-4694.
IBM Technical Disclosure Bulletin, vol. 20, #1, by Brach et al., Jun. 1977, p. 230.
IBM Technical Disclosure Bulletin, vol 21, #8, by Chu et al., Jan. 1979, pp. 3154-3156.
IEEE Transactions on Electron Devices, vol. 33, #3, pp. 354-360, Mar. 1986, Foster et al.
IEEE Transactions on Electron Devices, vol 28, #9, pp. 1084-1087, Sep. 1981, by Ohwada et al.

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