Metallic composition and methods for making and using the same

Details Metallic composition and methods for making and using the same Metallic composition and methods for making and using the same

1990-03-12

1992-10-06

Bell, Mark L.

Compositions

Electrically conductive or emissive compositions

Free metal containing

H01B 0102

Patent

active

051529319

ABSTRACT:
The invention provides a metallic composition and methods for making and using the same. In a preferred embodiment the metallic composition forms a conductor path and is bonded to a substrate of aluminum nitride. The metallic composition comprises Mo, Si, Cu and Mn. The Si may be present in the metallic composition as MoSi.sub.2. The metallic composition may be produced by firing a paste that has been applied to a substrate of aluminum nitride. The paste comprises an organic vehicle and a metallic powder. The metallic powder preferably comprises about 60% to about 90% by weight Mo, about 0.5% to about 15% by weight MoSi.sub.2, about 5% to about 20% Cu and up to about 20% by weight Mn.

REFERENCES:
patent: 4493789 (1985-01-01), Ueyama et al.
patent: 4952902 (1990-08-01), Kawaguchi
patent: 5011530 (1991-04-01), Kowdo et al.
Exhibit A-Molybdenum-Silicon Phase Diagram.
Exhibit B-Keramont Corporation-Aluminum Nitride Product Sheet.
Exhibit C-Titanium Nitride-Molybdenum Metallizing Method for Aluminum Nitride.

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