Tab mounted chip burn-in apparatus

Details Tab mounted chip burn-in apparatus Tab mounted chip burn-in apparatus

1989-07-18

1990-09-11

Karlsen, Ernest F.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

174 524, G01R 3102, H01L 2306

Patent

active

049566059

ABSTRACT:
A TAB package comprises an elongated tape which has a plurality of sets of beam leads emplaced thereon and a plurality of electronic devices connected to the beam leads. At least a first beam lead of each set is connected to a common potential terminal on each device, and at least a second beam lead of each set is connected to a power terminal. A common potential bus is oriented along the elongated dimension of the tape and connects to the first beam leads, while a power bus is also oriented along the elongated dimension of the tape and is connected to the second beam leads. The application of power to the power bus and the simultaneous grounding of the common potential bus enables all electronic devices on the tape to be simultaneously energized and to be then subjected to an elevated temperature environment for static burn-in testing. To improve current conduction in the power and common potential buses, a tape comprising a non-conductive carrier and a pair of interposer/conductor tapes may be emplaced over the length of the tape bearing the chips. An additional spacer tape is then emplaced over the interposer tape and forces the interposer conductors into contact with the power and common potential buses.

REFERENCES:
patent: 3560849 (1971-02-01), Ryan et al.
patent: 3761808 (1973-09-01), Ryan
patent: 4587548 (1986-05-01), Grabbe et al.
patent: 4716124 (1987-12-01), Yerman et al.
patent: 4745354 (1988-05-01), Fraser
patent: 4763409 (1988-08-01), Takekaiwa et al.
patent: 4779047 (1988-10-01), Solstad et al.
patent: 4855672 (1989-08-01), Shreeve

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