Printed wiring board with angled portion and its method of manuf

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

174 685, H05K 300

Patent

active

040744191

ABSTRACT:
An improved printed wiring board having a substrate disposed in at least two major planes and having conductors affixed to the substrate traversing between the at least two major planes. Further a method of manufacturing such an improved printed wiring board having a metal substrate is disclosed.

REFERENCES:
patent: 3296099 (1967-01-01), Dinella
patent: 3334395 (1967-08-01), Cook et al.
patent: 3385732 (1968-05-01), Curran
patent: 3911234 (1975-10-01), Kotaka
patent: 3930115 (1975-12-01), Uden
patent: 3934334 (1976-01-01), Hanni
patent: 3934335 (1976-01-01), Nelson
patent: 3971127 (1976-07-01), Giguere et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Printed wiring board with angled portion and its method of manuf does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Printed wiring board with angled portion and its method of manuf, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Printed wiring board with angled portion and its method of manuf will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-118526

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.