Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-12-15
1998-08-04
Sparks, Donald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257686, 257777, 361730, 361733, 361790, 361803, H05K 702, H05K 111, H05K 502, H01L 2312
Patent
active
057903808
ABSTRACT:
A multiple chip module architecture capable of forming structures having selectable aspect ratios which themselves form the basis for higher levels of integration in analogous manner. The modular architecture uses a flexible interconnect of patterned copper on polymer to successively reorient the connection plane between successive levels, permitting the selective stacking of module levels to create the desired aspect ratio of the multiple chip module. Interconnection between levels may be accomplished by solder reflow, direct dendritic bonding, or connection through a dendritic interposer.
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International Business Machines - Corporation
Salys Casimer K.
Sparks Donald
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