Package with reticulated bond shelf

Details Package with reticulated bond shelf Package with reticulated bond shelf

1998-01-13

2000-04-11

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361760, 361825, 361826, 361764, 361782, 361783, 361719, 361720, 257668, 257767, 257691, 257723, 257724, 338252, 338272, H05K 702

Patent

active

060494700

ABSTRACT:
A component package includes a case with a bond shelf and a conductive layer formed on the bond shelf. The bond shelf is characterized by an inward edge and an outward edge and at least one reticulation, each reticulation being characterized by an outward edge and an inward edge. The reticulation inward edge is co-linear with the bond shelf inward edge. The conductive layer includes a mounting pad for each reticulation and a serpentine conductor connecting the mounting pads, the mounting pad being disposed between the inward edge of the reticulation and the outward edge of the reticulation. The component package further includes a chip transistor mounted on a first mounting pad and a chip resistor mounted in a first reticulation. A semiconductor circuit mounted in the component package includes a bonding pad connected to a pad on the chip transistor and one end of the chip resistor.

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