Substrate with embedded member for improving solder joint streng

Details Substrate with embedded member for improving solder joint streng Substrate with embedded member for improving solder joint streng

1998-03-20

2000-04-11

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361769, 361772, 257669, 257690, 257692, 439 81, H05K 706

Patent

active

060494662

ABSTRACT:
There is disclosed herein an electronic circuit assembly, comprising: (1) a plastic molded substrate 10 having a first surface 12 with a mounting pad 14 disposed thereon; (2) a reinforcing member 20 having a first member portion 22 and a second member portion 24, wherein the first portion 22 is embedded within the substrate 10 beneath the first surface 12 thereof proximate the mounting pad 14 and wherein the second portion 24 is oriented generally parallel with and at a first predetermined distance h.sub.1 above the mounting pad 14; (3) an electronic surface mount component 18 having a termination 16 thereon, the component 18 being oriented such that the termination 16 is disposed at a second predetermined distance h.sub.2 above the second member portion 24; and (4) a solder joint 30 connecting the component termination 16 with the mounting pad 14 and the second member portion 24.

REFERENCES:
patent: 3487541 (1970-01-01), Boswell
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 5250847 (1993-10-01), Baskett
patent: 5294039 (1994-03-01), Pai et al.
patent: 5573172 (1996-11-01), Gore
patent: 5668701 (1997-09-01), Fukai
patent: 5682061 (1997-10-01), Khandros et al.
patent: 5763941 (1998-06-01), Fjelstad
patent: 5859472 (1999-01-01), DiStefano et al.

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