Semiconductor package

Details Semiconductor package Semiconductor package

1997-01-07

1998-08-04

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257730, H01L 2310

Patent

active

057898120

ABSTRACT:
A semiconductor package has a guide in the form of a lug only at least two diagonally opposite corners on the upper surface thereof. A cap to be adhered to the package is configured to mate with the inside surfaces of the guides. The package is, therefore, surely sealed and held in close adhesion to the cap.

REFERENCES:
patent: 1345856 (1920-07-01), Hughes
patent: 4630095 (1986-12-01), Otsuka et al.

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