Low profile ovenized oscillator packing having a high thermal co

Details Low profile ovenized oscillator packing having a high thermal co Low profile ovenized oscillator packing having a high thermal co

1998-09-10

2000-04-11

Mis, David

Oscillators

With outer casing or housing

With temperature modifier

331 68, 331108D, 331158, 310343, 310344, H03B 504, H03B 532, H01L 41053

Patent

active

060492562

ABSTRACT:
A low profile integrated oscillator operable to provide an oscillator signal includes a substrate having a cavity and a via passing through the substrate. A crystal or other resonator is disposed in the cavity and stabilizes the oscillator signal. An electrical circuit means is mounted to the substrate and electrically connects to the via to condition the oscillator signal. A cover seals the resonator in the cavity. A connector electrically connects the resonator to the via. A heater is mounted to the substrate to elevate the oscillator temperature and a temperature sensor is mounted to the substrate to monitor and control the oscillator temperature. The substrate is surrounded by an insulation and mounted within a housing. The housing has a connection means for connecting to an external electrical circuit.

REFERENCES:
patent: 3931388 (1976-01-01), Hafner et al.
patent: 4266157 (1981-05-01), Peters
patent: 4453104 (1984-06-01), Rapps et al.
patent: 4471259 (1984-09-01), Stoermer et al.
patent: 4524497 (1985-06-01), Rapps et al.
patent: 4750246 (1988-06-01), Pollard
patent: 4985655 (1991-01-01), Jensik et al.
patent: 5025228 (1991-06-01), Gerard et al.
patent: 5041800 (1991-08-01), Long et al.
patent: 5250870 (1993-10-01), Fenlon et al.
patent: 5382929 (1995-01-01), Inao et al.
patent: 5430345 (1995-07-01), Takahashi
patent: 5438219 (1995-08-01), Kotzan et al.
patent: 5568006 (1996-10-01), Luff et al.
patent: 5640746 (1997-06-01), Knecht et al.
patent: 5696422 (1997-12-01), Hanson et al.
patent: 5729181 (1998-03-01), Cutler et al.
patent: 5952894 (1999-09-01), Fukiharu

Affiliated with

Also associated with

Rating

Low profile ovenized oscillator packing having a high thermal co does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low profile ovenized oscillator packing having a high thermal co, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low profile ovenized oscillator packing having a high thermal co will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1179823