Thermal head formed of a flat cable encapsulated in a supporting

Details Thermal head formed of a flat cable encapsulated in a supporting Thermal head formed of a flat cable encapsulated in a supporting

1991-04-05

1992-01-21

Fuller, Benjamin R.

Recorders

Thermal recording

346139C, B41J 2395

Patent

active

050831399

ABSTRACT:
The present invention enables simplification of the assembly of a thermal head capable of performing printing at a high density and with a high resolution. A stable support of electrodes is also provided, along with an improvement in characteristics. The thermal head includes a parallel flat cable composed of a plurality of electrode wires aligned in flat fashion in a polymer insulating coating. A supporting body is made of a bonding agent which is abundant in rigidity and which encapsulates the polymer insulating coating, or encapsulates the electrode wires with a portion of the polymer insulating coating removed, at an end portion of the parallel flat cable at a printing plane.

REFERENCES:
patent: 4630074 (1986-12-01), Horinouchi et al.
patent: 4679054 (1987-07-01), Yoshikawa et al.
patent: 4680593 (1987-07-01), Takeno et al.

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