Fabrication process of a semiconductor device including grinding

Details Fabrication process of a semiconductor device including grinding Fabrication process of a semiconductor device including grinding

1999-07-29

2000-04-11

Picardat, Kevin M.

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

438 48, 438 57, H01L 2100

Patent

active

060487496

ABSTRACT:
A method of fabricating a semiconductor device includes the steps of protecting a front surface of a semiconductor substrate by an adhesive medium, grinding a rear surface of the semiconductor substrate in a state that the front surface is protected by the adhesive medium, removing the adhesive medium from the rear surface, and heating the semiconductor substrate, after the step of removing, to a temperature higher than a thermal decomposition temperature of an adhesive provided on the adhesive medium.

REFERENCES:
patent: 5171712 (1992-12-01), Wang et al.
patent: 5273938 (1993-12-01), Lin et al.
patent: 5344524 (1994-09-01), Sharma
patent: 5457072 (1995-10-01), Tamaki et al.

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