Integrated circuit device produced with a resin layer produced f

Details Integrated circuit device produced with a resin layer produced f Integrated circuit device produced with a resin layer produced f

1991-08-02

1992-11-17

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257788, H01L 2348, H01L 2944, H01L 2954

Patent

active

051648164

ABSTRACT:
An integrated circuit device wherein layer insulation is attained by at least one of (i) an insulator layer interposed between two adjacent conductor layers, and (ii) a surface protecting layer fixedly covering the surface of the semiconductor chip, each of the insulator layer and the surface protecting layer being made of a heat-resistant resin obtainable by heating a heat-resistant resin paste. Said paste consists essentially of a first organic liquid, a second organic liquid, a heat-resistant resin (B) which is soluble in an organic liquid mixture consisting of the first organic liquid and the second organic liquid, and fine particles of a heat-resistant resin (C) which is soluble in the first organic liquid but insoluble in the second organic liquid. The first organic liquid, the second organic liquid and the heat-resistant resin (B) are brought into a solution in which the fine particles of a heat-resistant resin (C) are dispersed.

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patent: 4632798 (1986-12-01), Eickman et al.
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patent: 4835197 (1989-05-01), Mercer
patent: 5023699 (1991-06-01), Hara et al.
patent: 5037862 (1991-08-01), Nishizawa et al.
Mukai; K. et al. "Planar Multilevel Interconnection Technology Employing A Polyimide" IEEE J. of Solid-State Circuits vol. SC-13, No. 4, Aug. 1978, pp. 462-467.

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