Semiconductor device having simple protective structure and proc

Details Semiconductor device having simple protective structure and proc Semiconductor device having simple protective structure and proc

1998-10-13

1999-10-05

Hardy, David B.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257780, 257784, H01L 2350

Patent

active

059629185

ABSTRACT:
A semiconductor integrated circuit device has a protective structure between a semiconductor chip and a ball grid array, and the protective structure has a thin polyimide film bonded to the surface of the semiconductor chip and a thick stress relaxation layer covering conductive strips connected between pads on the surface and the ball grid array; when thermal stress is exerted on the ball grid array, the thick stress relaxation layer allows said ball grid array to move so as to take up the thermal stress.

REFERENCES:
patent: 5376584 (1994-12-01), Agarwala
patent: 5604379 (1997-02-01), Mori
patent: 5726500 (1998-03-01), Duboz et al.
patent: 5753973 (1998-05-01), Yasunaga et al.
patent: 5793117 (1998-08-01), Shimada et al.
patent: 5834844 (1998-11-01), Akagawa et al.
patent: 5844304 (1998-12-01), Kata et al.

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