Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se
Patent
1997-04-15
1998-08-04
Sells, James
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Presses or press platen structures, per se
156382, 1565833, 425500, B32B 3120
Patent
active
057888086
ABSTRACT:
The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a cured thick compressible elastic pad is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves or corners during the lamination process. After the lamination process, the cured thick compressible elastic pad is conveniently removed from the cavity area without causing any damage to the cavity shelves or corners or having any paste pull-outs. This pad can be reused multiple number of times to form these MLC cavity substrates.
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Phillips, C. C., Jr., "Fixture for Fabricating Complex Substrate Design From Green Sheet Ceramics", IBM Technical Disclosure Bulletin, Vol. 16, No. 11, Apr. 1974, p. 3559.
Natarajan Govindarajan
Pasco Robert W.
Perry Charles H.
Peterson Vincent P.
Ahsan Aziz M.
International Business Machines - Corporation
Sells James
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