Chip card structure

Details Chip card structure Chip card structure

1988-12-16

1991-02-05

Pitts, Harold

Registers

Records

Conductive

235487, 235488, G06K 1906

Patent

active

049907590

ABSTRACT:
Disclosed is a method for the fabrication of chip cards. These cards are flat and undergo a high degree of deformation under bending and twisting stresses, when the user does not take any special precautions in their use. A micromodule is housed in a cavity of the card, and this micromodule is fixed by the natural adhesion between the plastic material of the bottom of the cavity and the coating resin of the integrated circuit of the module. To prevent the micromodule from being torn off during a bending stress undergone by the card, there is provision for at least one overhang by which the upper surface of the card covers an edge of the micromodule to limit the movements of said micromodule.

REFERENCES:
patent: 4463971 (1984-08-01), Yahya
patent: 4774633 (1988-02-01), Dehaine

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