Method for forming flattened film

Details Method for forming flattened film Method for forming flattened film

1984-04-19

1985-04-09

Newsome, John H.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 541, 427 96, 427375, B05D 306

Patent

active

045101736

ABSTRACT:
A flat film can be formed on a functional structure having uneven surface formed on a semiconductor substrate firstly by applying a film-forming organic material capable of being cured by energy beams and exhibiting fluidity by heat on the uneven surface of the functional structure. Then, the organic material is fluidized by applying heat to the applied organic material, thereby substantially flattening the surface of the organic material. Energy beams are irradiated to the flattened organic material to cure the flattened organic material, thereby converting the flattened organic material into a cured film which is not deformed by heat and energy beams.

REFERENCES:
patent: 3971316 (1976-07-01), Schank et al.
patent: 3976524 (1976-08-01), Feng
patent: 4171979 (1979-10-01), Novak et al.
patent: 4427713 (1984-01-01), White et al.
Bessemir, Radiation Curing, May 1976, pp. 10-16.

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