Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1982-10-06
1985-04-09
Woo, Jay H.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156269, 156283, 156295, 1563077, 156324, B29C 1900
Patent
active
045100080
ABSTRACT:
Copper-clad laminates for printed wiring boards with almost no warpage can be produced continuously without using a solvent by continuously running a continuous, fibrous substrate, supplying partially and intermittently a solventless thermosetting resin mixture to the running substrate, laminating a copper foil at least one surface of the running substrate, pressure molding with heating the copper foil laminated substrate in a mold comprising a pair of flat plates at least one of which has projecting portions tapered to the center of the flat plate at the periphery thereof, taking off and cutting the molded laminate.
REFERENCES:
patent: 4087300 (1978-05-01), Adler
patent: 4389453 (1983-06-01), Kitanaka et al.
Arai Masami
Fujioka Atsushi
Hoshi Ikuo
Miyadera Yasuo
Nakagawa Takehisa
Heitbrink Timothy W.
Hitachi Chemical Company Ltd.
Woo Jay H.
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