Patent
1982-06-25
1984-08-14
Edlow, Martin H.
357 50, 357 52, 357 55, H01L 2712, H01L 2704, H01L 2934, H01L 2906
Patent
active
044660120
ABSTRACT:
A semiconductor device includes therein a plurality of semiconductor elements. First passive isolation regions are formed along the buried layer and second passive isolation regions are formed perpendicularly along the buried layer, enclosing each of the semiconductor elements, additional passive isolation regions are provided at the end portions of the second passive isolation regions wherever the first and second passive isolation regions merge. The additional passive isolation regions are deeper than the second passive isolation regions.
REFERENCES:
patent: 3575740 (1971-04-01), Castrucci et al.
patent: 4255207 (1981-03-01), Nicolay et al.
patent: 4269636 (1981-05-01), Rivoli et al.
patent: 4320411 (1982-03-01), Fukushima
patent: 4375645 (1983-03-01), Funatsu
Edlow Martin H.
Fujitsu Limited
Jackson Jerome
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