Nickel-base solder for high-temperature solder joints

Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils

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148403, 420441, B32B 1500

Patent

active

049006380

ABSTRACT:
Nickel-based solder compositions having improved wetting behavior, the soldering alloys containing aluminum and chromium, and one or more of the metals zirconium, niobium, or titanium added to the solder in amounts of from 0.1 to 5 atomic percent. Particularly effective soldering alloys contain 0 to 4 atomic percent iron, 0 to 21 atomic percent chromium, 0 to 19 atomic percent boron, 0 to 12 atomic percent silicon, 0 to 22 atomic percent phosphorus, 0 to 3 atomic percent carbon, and 0.1 to 5 atomic percent niobium, zirconium, or titanium, the remainder being nickel, the boron, carbon, silicon, and phosphorus concentrations totaling from 16 to 24 atomic percent.

REFERENCES:
patent: 3902900 (1975-09-01), Restall et al.
patent: 4394560 (1983-07-01), Kishida et al.
patent: 4396822 (1983-08-01), Kishida et al.
patent: 4673123 (1987-06-01), Shin et al.
Steffens article (same as article (AR) on 1/24/89).
Steffens et al., "Benetzungsprobleme und ihre Beseitigung beim Hart--und Hochtemperaturloten", DVS 92, (1984), pp. 6-11.
K. Emmerich, "Rapidly Solidified Active Filler Alloys for Direct Brazing of Non--Metallized Ceramics", Sonderdruck aus der Proceedings of the 1st International Conference on Rapidly Solidified Materials, San Diego, CA, Feb. 3-5, 1986.

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