Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-11-19
1998-08-04
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
22818021, 22818022, 228215, H01R 906
Patent
active
057875804
ABSTRACT:
A method for making a RF module by a ball grid array package includes: perforating a feed-through hole which penetrates top and bottom surfaces of a terminal position of a chip populated on a substrate; forming a conductive line connecting top and bottom surfaces of said substrate into said feed-through hole; coating a part excepting a ball grid array pad on said conductive line with an insulator, by using emulsion mesh on said top surface of said substrate; making a stencil mask which provides a predetermined-sized aperture on a top surface of said ball grid array pad by using a metal mesh, and printing a solder paste on said ball grid array pad by using said stencil mask; and forming a ball grid array package solder ball through a reflow soldering of the solder paste in a nitrogen atmosphere. This method accuratly and easily forms a desired RF module without a solder printing process about a minute terminal pattern, thereby reducing a cost of production and preventing a poor product.
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Arbes Carl J.
LG Information & Communications Ltd.
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