Metallization layer structure formed on aluminum nitride ceramic

Details Metallization layer structure formed on aluminum nitride ceramic Metallization layer structure formed on aluminum nitride ceramic

1988-08-24

1990-12-25

Lechert, Jr., Stephen J.

Stock material or miscellaneous articles

All metal or with adjacent metals

Having metal particles

428627, B22F 300

Patent

active

049802399

ABSTRACT:
A metallization layer structure includes an intermediate layer formed on an aluminum nitride ceramics base. The intermediate layer contains aluminum titanium nitride. A titanium layer is formed on the intermediate layer. A heat-resistant metallic layer is formed on the titanium layer. A metallic layer for facilitating soldering or brazing is formed on the heat-resistant metallic layer.

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patent: 2798577 (1957-07-01), Forge, Jr.
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patent: 3057445 (1962-10-01), Bronnes
patent: 3107756 (1963-10-01), Gallet
patent: 4503130 (1985-03-01), Boshart et al.
patent: 4761345 (1988-08-01), Sato et al.

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