Method and apparatus for the quantitative measurement of adhesio

Details Method and apparatus for the quantitative measurement of adhesio Method and apparatus for the quantitative measurement of adhesio

1989-05-04

1990-02-13

Cuchlinski, Jr., William A.

Measuring and testing

Coating material: ink adhesive and/or plastic

G01N 1904, G01N 310

Patent

active

048995819

ABSTRACT:
A device for quantitatively measuring adherence of thin films provides a first substrate having an upper surface and a second substrate having a surface coplanar therewith. The second substrate is spaced on all sides from the first substrate by a cavity. The thin film is suspended over the cavity and adhered to the surfaces of the two substrates. A characteristic length of the area of the surface of the second substrate to which the film is adhered is made small relative to the characteristic length of the cavity. A pressure differential is applied across the thickness of the film such that the film debonds from the surface of the second substrate. Mechanical characteristics of the debonding of the film are observed and measured. The characteristics are thereafter related to provide a quantitative measurement of adherence of the thin film to the second substrate. A measurement of relative adherence between different films is obtained by testing a multilayered film structure. Other layers of various materials may be used to define a smaller area of adherence to which the film may be adhered.

REFERENCES:
patent: 4501154 (1985-02-01), Mori
patent: 4612805 (1986-09-01), Bruce et al.
J. W. Beams, "Mechanical Properties of Thin Films of Gold and Silver", Structure and Properties of Thin Films, editors: D. A. Neugebauer, J. B. Newkirk, D. A. Vermilyea; John Wiley & Sons, New York, (1959), pp. 183-192.

Affiliated with

Also associated with

Rating

Method and apparatus for the quantitative measurement of adhesio does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for the quantitative measurement of adhesio, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for the quantitative measurement of adhesio will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1159898