Ceramic composition for multilayer printed wiring board

Details Ceramic composition for multilayer printed wiring board Ceramic composition for multilayer printed wiring board

1985-04-30

1986-11-25

Bell, Mark L.

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 18, 501 26, 501 32, 501 67, 501 79, C03C 820, C03C 816, C03C 1400, C03C 3066

Patent

active

046249346

ABSTRACT:
A ceramic composition for a multilayer printed wiring board, consisting essentially of from 35 to 95% by weight of glass powder and from 5 to 65% by weight of refractory filler powder, said refractory filler powder being at least one member selected from the group consisting of .alpha.-quartz, corundum, zircon and zirconia and said glass powder consisting essentially of from 25 to 40% by weight of SiO.sub.2, from 4 to 15% by weight of Al.sub.2 O.sub.3, from 15 to 25% by weight of B.sub.2 O.sub.3, from 15 to 40% by weight of BaO+CaO+MgO, from 1 to 10% by weight of ZnO and from 0.5 to 5% by weight of ZrO.sub.2.

REFERENCES:
patent: 3673092 (1972-06-01), Dietz
patent: 3775164 (1973-11-01), Smith et al.
patent: 4039338 (1977-08-01), Swiss et al.
patent: 4153491 (1979-05-01), Swiss et al.
patent: 4547625 (1985-10-01), Tosaki et al.

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