Hot melt resinous composition comprising a primary resin, a wax

Details Hot melt resinous composition comprising a primary resin, a wax Hot melt resinous composition comprising a primary resin, a wax

1976-02-25

1976-11-02

Wong, Jr., Harry

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

526207, 526226, 526281, C08L 9106

Patent

active

039896587

ABSTRACT:
This invention discloses a hot melt resinous composition comprising a primary resin, a wax and a solid, homogeneous and essentially random terpolymers of styrene, isobutylene and beta-pinene having a number average molecular weight of from about 1500 to about 7000, a styrene content of from about 40 to about 60 weight percent, an isobutylene content of from about 10 to about 40 weight percent, a beta-pinene content of from about 10 to about 40 weight percent and a ring and ball softening point of from about 160.degree. to about 240.degree. F.

REFERENCES:
patent: 3478002 (1969-11-01), Nakaguchi

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