Method of making integrated circuit silicon die composite having

Details Method of making integrated circuit silicon die composite having Method of making integrated circuit silicon die composite having

1985-01-17

1986-11-25

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156265, 156329, 427240, 427289, B32B 3118

Patent

active

046247246

ABSTRACT:
A method is provided for making integrated circuit silicon composite die having a hot melt adhesive on the surface of its silicon base. An integrated circuit silicon wafer silicon composite die in wafer form is diced after a hot melt adhesive has been applied onto its silicon base utilizing a spin coating procedure. Integrated circuit silicon composite arrays are also provided by integrally bonding the integrated circuit silicon die onto a carrier substrate.

REFERENCES:
patent: 3600246 (1971-08-01), Breen
patent: 4011279 (1977-03-01), Berger et al.
patent: 4347302 (1982-08-01), Gotman
patent: 4385083 (1983-05-01), Shelley

Affiliated with

Also associated with

Rating

Method of making integrated circuit silicon die composite having does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making integrated circuit silicon die composite having, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making integrated circuit silicon die composite having will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1156921