Structure and method for mounting an electric part

Details Structure and method for mounting an electric part Structure and method for mounting an electric part

1999-02-12

2000-08-08

Gaffin, Jeffrey

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361783, 361820, 257787, 257788, 257791, 174255, 174260, 174261, 22818021, H05K 706

Patent

active

061010987

ABSTRACT:
A structure in which an electronic part is mounted on a substrate via mount resin and has electrodes thereof connected to electrodes arranged on the substrate for wire bonding by conductors is disclosed. A frame for preventing the mount resin from flowing out is formed on the substrate between a portion for mounting the electronic part and the electrodes for wire bonding. The structure prevents the mount resin from flowing out with a relatively simple scheme at low cost, and allows the number of semiconductor chips or similar electronic parts to be increased in order to implement high-density buildup wiring.

REFERENCES:
patent: 4814943 (1989-03-01), Okuaki
patent: 4926240 (1990-05-01), Regione
patent: 5313365 (1994-05-01), Pennisi et al.
patent: 5332864 (1994-07-01), Liang et al.
patent: 5336931 (1994-08-01), Juskey et al.
patent: 5577319 (1996-11-01), Knecht
patent: 5885854 (1999-03-01), Wensel

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