Heat dissipating structure for electronic terminal device

Details Heat dissipating structure for electronic terminal device Heat dissipating structure for electronic terminal device

1999-03-04

2000-08-08

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361687, 361690, 361694, 361695, 361704, 361707, 361721, 174 151, 174 161, 174 163, 165 803, 165185, H05K 720

Patent

active

061010952

ABSTRACT:
A heat dissipating structure for an information terminal device such as an electronic cash register includes a substrate mount chassis having a heat dissipating portion. The substrate mount chassis has disposed in a chamber thereof a substrate. The substrate is arranged in the chamber of the substrate mount chassis and has disposed thereon an electronic component such as a high-speed CPU which generates a relatively large amount of heat. A heat conducting member such as a silicone rubber is disposed between the CPU and the heat dissipating portion in contact therewith for dissipating the heat generated by the CPU into the surrounding atmosphere.

REFERENCES:
patent: 5424913 (1995-06-01), Swindler
patent: 5440450 (1995-08-01), Lau et al.
patent: 5559675 (1996-09-01), Hsieh et al.
patent: 5694294 (1997-12-01), Ohashi et al.
patent: 5768102 (1998-06-01), Ma
patent: 5793609 (1998-08-01), Donahoe et al.

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